Samsung to Manufacture Nvidia Memory Dies Using TSMC 3nm Process in First Use of Rival Foundry Tech

Samsung Electronics will use TSMC’s 3-nanometre process to produce base dies for Nvidia’s custom NVHBM memory. According to Reuters, this arrangement marks Samsung’s first use of TSMC’s foundry technology. The move follows a request from Nvidia to its key memory partners, including SK Hynix and Micron, to adopt this specific manufacturing method for advanced AI memory chips.

Root cause

The shift in manufacturing strategy originates from Nvidia’s requirement for base dies produced on TSMC’s 3nm process. According to Reuters, Nvidia approached Samsung, SK Hynix, and Micron with this specific technical directive. Samsung agreed to the terms, establishing a new supply chain dynamic for high-bandwidth memory components. The source material does not state the status of SK Hynix or Micron’s responses.

Attack path

This report concerns a supply chain and manufacturing agreement rather than a security vulnerability. There is no attack path, exploit, or bug class involved in this transaction. The event describes a commercial and technical partnership between semiconductor manufacturers. Consequently, there are no threats to user data, system integrity, or network security resulting from this announcement.

Affected versions

This announcement applies to Nvidia’s custom NVHBM memory components. It specifically involves base dies manufactured by Samsung using TSMC’s 3nm process. No software versions, firmware releases, or operating system updates are affected by this manufacturing change. The impact is limited to the physical production of hardware components for artificial intelligence accelerators.

Mitigation

• No mitigation is required as this is not a security incident.
• Monitor official channels for updates on hardware availability.
• Review supply chain contracts for changes in manufacturing partners.
• Ensure procurement teams are aware of the new foundry arrangement.

What it means for organisations

Operations and procurement teams should assess how this manufacturing shift impacts hardware delivery timelines. Organisations relying on Nvidia’s AI infrastructure must verify that their suppliers are informed of this change. Risk managers should evaluate potential supply chain dependencies on TSMC’s 3nm capacity. Engineering leads need to confirm that performance specifications remain consistent despite the new foundry process. Communication with vendors is essential to understand any logistical adjustments.

Background: Supply chain attacks

Supply chain attacks in cyber security exploit the trust you place in third-party software components. Attackers inject malicious code into legitimate updates or build pipelines. You receive the payload as if it were benign. Defending requires verifying code origins, isolating build environments and treating all external inputs as hostile.

Read the full guide: Supply chain attacks in cyber security: how they work and how to stop them

What to do and how to stay safe: Nvidia

• Review current hardware procurement contracts for clauses regarding manufacturing changes.
• Contact your Nvidia or memory supplier representative to confirm delivery schedules.
• Update internal asset registers to reflect the new manufacturing source for future units.
• Monitor industry news for further announcements from SK Hynix or Micron.

General security guidance from the TechSec Observer newsroom. It is not confirmed advice from the organisations named in this story.

Frequently asked questions

Which companies were asked to use TSMC's 3nm process?

Nvidia asked Samsung, SK Hynix, and Micron to produce base dies on this process.

Has Samsung confirmed it will proceed with the plan?

Sources tell Reuters that Samsung agreed to use TSMC's 3nm process.

Is this a security vulnerability?

No, this is a manufacturing and supply chain announcement, not a security flaw.